Signode to debut packaging technology innovations next month
Packaging equipment manufacturer Signode will unveil new technology at PACK EXPO International 2024, set for Nov. 3-6 in Chicago.
The company will exhibit live demonstrations of its end-of-line transit packaging solutions, including innovations in its portfolio of strapping solutions, according to a news release.
“At PACK EXPO 2024, we are excited to demonstrate how innovation drives every aspect of our end-of-line packaging solutions, from automated equipment to packaging consumables,” Mike Wolf, senior director of Signode Technologies, said in the release. “The new solutions we’re introducing at the show highlight our commitment to creating easy-to-use, adaptable systems that align with the evolving challenges facing today’s manufacturers.”
Among these innovations debuting next month is the fully automated SGP-5330 strapping bundler.
The latest addition to the SGP series offers a smart touchscreen HMI and advanced IoT integration for real-time equipment monitoring and proactive maintenance.
Signode will also present demonstrations of an integrated packaging system featuring its new GCU-3 strapping unitizer and the fully automatic Octopus S Series stretch wrapping machine.
Equipped with up to six modular heads for enhanced flexibility and throughput, the GCU-3 uses sensitive compression and variable head tension to strap delicate loads.
The Octopus S Series uses an “S” wrap pattern to optimize load containment and minimize film usage, enabling it to wrap up more than 100 loads per hour.
