Six packaging industry hopefuls get boost from PACK EXPO scholarship program
Six PACK EXPO Scholarship recipients were recognized Oct. 15 at the annual PACK gives BACK networking reception, sponsored by Rockwell Automation, at PACK EXPO International and co-located Healthcare Packaging EXPO (Oct. 14-17; McCormick Place, Chicago). The PMMI Foundation awards the scholarships annually to six students from PMMI Partner Schools, according to show producer, PMMI, The Association for Packaging and Processing Technologies.
“PACK gives BACK is an attendee favorite year after year, and we’re proud to support the education of next generation’s industry leaders,” said Jim Pittas, president and CEO, PMMI.
To qualify for the $5,000 individual scholarship, students must have a minimum 3.0 grade point average, demonstrate a financial need and major in engineering, packaging, processing, mechatronics or a related field.
2018 Winners of PACK EXPO Scholarships:
- Philip Anjorin, Dunwoody College of Technology. Majoring in Industrial Controls and Robotics.
- Raymond Cummings, Clemson University. Majoring in Packaging Science.
- Crystal Daughtry, Community College of Allegheny County. Majoring in Mechatronics.
- Laura Kershaw, Rutgers University. Majoring in Packaging Engineering.
- Kate Quade, University of Wisconsin, Stout. Majoring in Packaging.
- Rachael Schodowski, Michigan State University. Majoring in Packaging.
